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金鉴提供页岩样品氩离子抛光、切割服务（离子抛光法CP）+高分辨率场发射扫描电镜SEM观察。金鉴实验室氩离子抛光（CP法抛光）制样，可以获得平滑的截面，而不会对样品造成机械损害。以下为案例展示。
平面刻蚀抛光功能 左图为离子研磨前，右图为研磨后，通过离子研磨可以去除机械研磨抛光对样品产生的应力损伤，从右图中可以清楚看到两种不同铜的结构
平面刻蚀抛光功能 通过控制平面研磨时间，可以获得更多样品的细节信息
Package FA
Results of experiment
SEM Parameter： Accelerating Voltage: 1KV Magnification: 600X Imaging Mode: back-scattered electron
Package：FA ，Cooling Stage
SEM Parameter： Accelerating Voltage: 1KV Magnification: 2,500X Imaging Mode: back-scattered electron
Package：FA ，Cooling Stage SEM Parameter： Accelerating Voltage: 1KV Magnification: 5,000X Imaging Mode: back-scattered electron
Package：FA ，Cooling Stage SEM Parameter： Accelerating Voltage: 1KV Magnification: 10,000X Imaging Mode: back-scattered electron
Package：FA；Cooling Stage
PCB Board：Cooling Stage
Die package application
Results
High Mag
PCB with OSP layer Low Mag PCB with OSP layer High Mag
TSV
Central TSV
Center TSV near middle of length
Low K Material
分立器件
High Mag
High Mag
Cu wire with Pdcoating
2.5D Interposer GatanResults Polished Width at ROI ~ 1000um
High Mag
BSE Image “Left Via”
SE Image Region 9 BSE Image Region #9
BSE Image Region #10 BSE Image “Right Via”
金属镀层 镀锌钢板
镀锌钢板-High Mag
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